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Moisture Meter and Thermal Imager with MSX®
FLIR MR265
The FLIR MR265 is a professional pin and pinless moisture meter with thermal imaging designed to show you exactly where to investigate issues related to moisture, air leaks, and insulation voids. Featuring IGM™ (Infrared Guided Measurement) and MSX® (Multi-Spectral Dynamic Imaging enhancement) technology, the MR265 helps you quickly scan and target problem areas, visually guiding you to the spot where you can confidently take measurements, analyze readings, and ensure that problems are fixed. Using FLIR Thermal Studio™, you can then create and share professional reports that include findings and proof of repairs – giving your clients peace of mind that mold, rot, or moisture challenges have been resolved.
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Pitot Tubes
The dpm-i Pitot Tube is a new design concept in Pitot Static Tube technology. It is a multi-functional sensor. It can replace thermally heated instruments, where power requirements are high. Gives easy access to duct measurement compared to a standard Pitot Tube. For example, in ceilings voids and confined areas, where there is a thick lagging or metal cladding.
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SAM Auto Line
PVA TePla Analytical Systems GmbH
The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.
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Radiographic Inspection Test
The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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Partial Discharge Tester (Dry Type)
Partial Discharge testing is a way of detecting voids or imperfections in insulators that would lead to overheating and breakdown under normal operating conditions. Due to the nature of the signal being measured, this test is very susceptible to electronic and RF noise and a proper corona-free properly isolated test chamber is required.
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Gravity Measurement
Quantum gravity measurement is emerging as a new frontier in sensing, bringing the ability to passively detect objects and voids, through difficult to penetrate materials such as soil, rock, lead and water. Gravity measurement using cold atom interferometers is set to revolutionise nearly all industries from civil to oil and gas, mining to maritime, and medical to defence.
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Inspection System
X-eye 7000B
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Inspection System for Die Casting
X-eye 7000BS
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Front and Back Side Topography Defect Detection
LIGHTsEE
High throughputNanometer range vertical sensitivitySimultaneous double side inspectionNanotopography and Topography measurementDetection of Slip lines, particles, Hairline cracks, SOI voids, Comets, EPI defects…Compliant with thin or thick wafers, taiko wafers, highly warped wafers
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High Speed Data Acquisition
All systems can be set up in two types of aluminum chassis. These are the conduction cooled rugged 3U VPX chassis “Crosswind 600” and “Desert Gecko” . Ruggedized and sealed to IP65. These units can use void fillers and GORE brand vents depending on the deployment environment.
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Entry Level GPR System for Concrete Inspection
StructureScan Mini LT
Geophysical Survey Systems, Inc.
The StructureScan™ Mini is GSSI’s all-in-one GPR system for concrete inspection. This handheld system locates rebar, conduits, post-tension cables, voids and can be used to determine concrete slab thickness in real-time.
