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CTE Tester
CTE-360
The CTE-360 measures thermal expansion coefficients on wide range of materials over a temperature range of -20°C to 100°C. Although intended primarily for the study of materials used in electronic packaging applications, it can be used on virtually any solid, gel, paste, or viscous liquid over this temperature range.
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Horizontal Dilatometers
TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
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Thermal Analysis
Thermal Analysis is important to a wide variety of industries, including polymers, composites, pharmaceuticals, foods, petroleum, inorganic and organic chemicals, and many others. These instruments typically measure heat flow, weight loss, dimension change, or mechanical properties as a function of temperature. Properties characterized include melting, crystallization, glass transitions, cross-linking, oxidation, decomposition, volatilization, coefficient of thermal expansion, and modulus. These experiments allow the user to examine end-use performance, composition, processing, stability, and molecular structure and mobility.
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Ultrasonic Leak Detector
Tru Pointe Ultra
The Tru Pointe® Ultra is a low-cost handheld ultrasonic leak detector capable of finding leaks of any gas type, including refrigerants, air (compressed or vacuum) and nitrogen. The Tru Pointe® Ultra can also be used for thermal expansion valves and steam traps, making it a very versatile leak detector.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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High Power/Anti-Surge/High-Voltage Resistors
ERJ-P Series
Panasonic Industrial Devices Sales Company of America
Panasonic’s ERJ-P Series High Power Resistors offer the ability to use smaller case sizes while still maintaining the same level of power or better in respect to conventional size Thick Film Resistors. The ERJ-P Series has a unique trimming pattern and high heat dissipation characteristics. These parts can be easily designed as replacements for existing Thick Film Resistors due to comparable technology and materials with use of better manufacturing processes. The ERJ-P Series has an operating temperature of -55°C to 155°C, with a smaller part, you have a higher solder-joint reliability. Less material means less solder which lowers risk for solder fracture due to thermal expansion or contraction. Panasonic High Power Resistors are AEC-Q200 Qualified.
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Automatic Test Equipment
Wewon Environmental Chambers Co, Ltd.
Automated Test Equipment (ATE) adopts PID+PWM principle VRF (Refrigerant flow control) technology to realize low temperature and energy saving operation (servo control technology of refrigerant flow based on thermal condition of electronic expansion valve). Realize the automatic constant temperature of the studio.https://www.wewontech.com/automatic-test-equipment/
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Software
Interface Analysis
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Coupler Workstations
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
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Thermal Analysis
The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
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Thermal Shock Chamber
Sanwood Environmental Chambers Co ., Ltd.
Three zone thermal shock chamber uses the test material structure or composite material to withstand the degree of extreme high temperature and low temperature in a continuous environment in an instant, so as to test the chemical changes or physical damage caused by thermal expansion and contraction in the shortest time.
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Ultrasonic Leak Detector
Tru Pointe 2100
Bacgarach’s Tru Pointe® 2100 Ultrasonic Leak Detector is an ultra-versatile ultrasonic leak inspection system that can be used for both leak detection and mechanical PPM/inspection/troubleshooting. It is capable of finding leaks of any gas type, including refrigerants, air (compressed or vacuum) and nitrogen. The Tru Pointe® 2100 can also be used for thermal expansion valves, steam traps, bearings and more.
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Portable Leak Detection
Ultrasonic
Bacharach's ultrasonic-based leak detectors support a variety of applications, including: Combustible and Refrigerant Gases, Compressed Air and Pneumatic Systems, Inert Gases (CO2, Nitrogen, Helium, etc.), Steam Trap Leak Detection, Condensate Flow, Thermal Expansion Valves (TXV), Solenoids, Mechanical Problems (Bearings, Wear), Electrical Arcing, Sealed Enclosures, Tanks, and Rooms, and Condition-Based Monitoring:
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Ultrasonic Leak Detector
Tru Pointe 1100
The Tru Pointe® 1100 is an ultra-versatile ultrasonic leak inspection system that can be used for both leak detection and mechanical inspection/troubleshooting. It is capable of finding leaks of any gas type, including refrigerants, air (compressed or vacuum) and nitrogen. The Tru Pointe® Ultra can also be used for thermal expansion valves, steam traps, bearings and more.
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Carbon Fibre Beam Gauge
Designed to measure both internal and external diameters and lengths, the high modulus carbon fibre beam is stiff, lightweight and has an extremely low co-efficient of thermal expansion (CTE). Suitable for measuring high accuracy diameters and lengths up to 4000mm+.
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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3.5" Embedded SBC With Intel® Atom® Processor E3845/E3827, LVDS/VGA/HDMI, Dual LANs, Audio And ZIO
CAPA840
The CAPA840, a fanless 3.5-inch embedded single board computer, is based on the latest generation of Intel® Atom® processor E3845 or E3827 featuring 1.91/1.75GHz clock speed. Two DDR3L SO-DIMM slots support system memory up to 8 GB. Moreover, the fanless embedded board delivers better level of processing and graphics performance than previous generation Intel® Atom™ SBCs, while consuming less power. In addition to rich onboard I/Os, the CAPA840 adopts an ZIO connector on the rear-side that integrates PCIe x1, USB, LPC and SMbus expansion. With excellent thermal design, the 3.5” embedded board is able to run fanless and works smooth between -20°C to 70°C environments.
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Benchtop Thermal Forcing System
Wewon Environmental Chambers Co, Ltd.
Benchtop thermal forcing system from Wewon Environmental Chambers Co., Ltd. has a mini body structure and affordable machine price. The machine can test a wide temperature range, Since no compressor is required for refrigeration, so the benchtop temperature forcing unit’s energy consumption is very low. The repeated resistance degree of the tested sample in the instantaneous extremely high temperature and extremely low temperature continuous environment can detect the chemical changes and physical damage caused by thermal expansion and cold contraction of the sample in the shortest time, so as to achieve the goal of confirming the quality of the tested sample.https://www.wewontech.com/benchtop-thermal-forcing-system/
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Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Computer-On-Module
CM22301
LinkedHope Intelligent Technologies Co.,Ltd.
CM22301 uses Intel® sixth-generation Skylake platform and Core M low-power SoC processors, and integrates the full functions of CPU, GPU and South/North Bridge on a single chip. The processor provides powerful computing and display performance with dual-core and four threads configuration. Its turbo frequency can boost up to 3.1GHz and the display output resolution can be up to 4K. CM22301 has an amazing thermal design power consumption of only 4.5W (TDP) and can be used for a variety of high-performance fanless designs. CM22301 supports up to 16GB dual-channel low-voltage DDR3L memory populated onboard, and up to 64GB on-board solid state disk silicon, as benefit the development of ruggedized products for harsh environment applications.As defined by VITA 59 specification, CM22301 provides up to 6 PCIe lanes, enabling flexible functionality expansions, such as NICs, DAQs, video capture and so on. Meanwhile, CM22301 also provides up to date computer interfaces like GbE, SATA3, USB3.0/2.0, HD Audio, etc. CM22301 uses the same 220pin board-to-board connector and Type10 pin out definition as COM Express.
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Electrostatic chucks
Semiconductor substrates such as Si wafers or masks for the next generation of extreme ultraviolet lithography (EUVL) are handled in a vacuum. For nm structures and exact overlay, the reproducibility of the substrate evenness is a crucial factor, as unevenness results in structural distortions. Particles are problematic and heat input as well as thermal expansion must be taken into account.
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Thermal Shock Test Chamber
observe the product characteristics and failure occurrences caused by different materials and their thermal expansion coefficients, thermal shock testing is subjected to the product. In thermal shock testing alternating high and low temperatures are fed in the chamber. WEIBER designs and manufactures customised THERMAL SHOCK CHAMBERS with separately controlled temperature zones (2 zone and 3 zone), liquid to liquid (2 zone) depending on configuration of the chamber chosen.
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Walk-In Test Chamber
Sanwood Environmental Chambers Co ., Ltd.
Energy-saving design: Adopting PID + PWM principle of VRF (refrigerant flow control) technology to achieve low-temperature energy-saving operation (electronic expansion valve according to thermal energy conditions refrigerant flow servo control technology) low temperature working state, the heater does not participate in the work, through PID + The PWM regulates the flow rate and flow direction of the refrigerant, and regulates the three-way flow of the refrigerant pipe, the cold bypass pipe, and the hot bypass pipe to achieve automatic constant temperature to the working chamber. This method can reduce energy consumption by 30% under low temperature conditions. The technology is based on Danish Danfoss' ETS series of electronic expansion valves, which can be used to smoothly adjust the cooling capacity for different cooling capacity requirements, that is, to achieve the compressor cooling capacity adjustment when different cooling rate requirements are met.
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Material Sensor
E1737A
The Keysight E1737A Material Sensor monitors the temperature of an object being measured or of the work piece itself. The sensor detects temperature changes and automatically compensates for thermal expansion errors.
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One Axis Differential Interferometer
10719A
The Keysight 10719A One Axis Differential Interferometer makes either a differential linear or angular measurement for use in single and multiple axis applications. The linear measurement gauges the displacement between two objects, such as a stage and an optical column or inspection tool. The 10719A also measures either pitch or roll. An angle is measured when both reference and measurement beams measure to the same mirror. The 10721A provides high immunity to unwanted interferometer displacement, such as thermal expansion. It is a modular, compact design with monolithic optics for maximized mechanical stability. Use of a small 3 mm beam helps decrease Abb offset error.
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Two Axis Differential Interferometer
10721A
The Keysight 10721A Two Axis Differential Interferometer, when used in multiple axis applications, simultaneously makes two differential measurements linear and angular (yaw) displacement. Both measurements reference external mirror mounted to an object such as a column or inspection tool. The 10721A provides high immunity to unwanted interferometer displacement, such as thermal expansion. It is a modular, compact design with monolithic optics for maximized mechanical stability. Use of a small 3 mm beam helps decrease Abb offset error. The 10721A is similar to the 10719A Single Axis Differential Interferometer, except that it provides an additional measurement axis.
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Thermal Shock Chambers
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
