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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Anti-Sulfur Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide variety of Thick Film Current Sense Resistors (ERJ-B1, B2, xB, xBW, xCW) in a large range of case sizes and in wide terminal types for high solder joint reliability. The ERJ Series of Current Sense Resistors offers power ratings up to 2W with low ohmic ratings ranging from 5mΩ to 10Ω. Panasonic’s Thick Film Current Sense Resistor portfolio offers a more cost effective option with high reliability. Panasonic has a wide line of case size options ranging from 0402 to 2512 in conventional terminal and 0612 to 1020 for wide terminal.
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Current Sense Resistors
Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide variety of Thick Film Current Sense Resistors (ERJ-B1, B2, xB, xBW, xCW) in a large range of case sizes and in wide terminal types for high solder joint reliability. The ERJ Series of Current Sense Resistors offers power ratings up to 2W with low ohmic ratings ranging from 5mΩ to 10Ω. Panasonic’s Thick Film Current Sense Resistor portfolio offers a more cost effective option with high reliability. Panasonic has a wide line of case size options ranging from 0402 to 2512 in conventional terminal and 0612 to 1020 for wide terminal.
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3D AOI with Revolutionary New 3D Measurement
Zenith
The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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3D Automated Optical Inspection
Zenith UHS
High-speed full 3D AOI that brings about a revolution in SMT process management Industry-leading speed for full 3D measuring inspection equipment skill solutions- Only solution in the industry to set inspection criteria according to IPC-610 standards- Performs defect diagnosis through measurement-based data and eliminates the causes of possible errors- Powerful 3D solder joint inspection
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Event Detectors
STD Series
The STD Series Event Detectors offer test specifications associated with solder joint reliability testing but can also be used for testing other types of interconnects accordingly. Like other Event Detectors, the STD series provides continuous transient resistance detection referenced to a selected threshold resistance with a high degree of electrical noise immunity.
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Highly Accelerated Thermal Shock (HATS2™) Testing
NTS is the exclusive provider of HATS2™testing services in North America. Thermal shock testing has long been the accepted method to check robustness and reliability of plated-through holes and solder joint connections. Historically, thermal shock testing has been performed utilizing either dual chamber air-to-air systems or liquid-to-liquid systems. Both of these methods offer significant disadvantages in cost, time, and the fact that the samples must be transported between the hot and cold environments. Transportation of the samples between the temperature environments makes monitoring the resistance of the samples difficult and inaccurate due to the length and quantity of wires. The infrequent monitoring typically associated with traditional thermal shock methods also makes detection of “glitch” conditions marginal at best.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Solder Joint Inspection – AOI
S3088 ultra
*Extremely fast AOI camera system.*Scalable, modular camera technology with 3D measuring function.*Greatest inspection depth: reliable inspection of 03015 und fine-pitch components.*Maximum fault coverage - 9 views plus 3D measurement.*Best resolution at angled views.*Height measurement of components.*Extremely high throughput due to FastFlow Handling.*Revolutionary simplicity in AOI operation with vVision.*Fast program generation with vVision/EasyPro.*Reading DataMatrix code, bottom up.
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Solder Joint Reliability Testing
Solder joint reliability is defined as the ability of your product’s solder joints to function under given conditions and for a specified period of time without exceeding acceptable failure levels.Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits. The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. This provides you with useful technical information for future designs, saving you time and money.
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Testing & Measurement Services
Delserro Engineering Solutions
Delserro Engineering Solutions is your complete source forHALT/HASS, Accelerated Life Testing, Environmental Testing, Lead Free Solder Joint Reliability Testing, Linear andNon-Linear FEA, Computational Fluid Dynamics (CFD)
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In-Line X-ray Inspection System
X-eye 6200
Automatically in-line inspect Solder joint defects of PCBA, and other defects on Hidden Components.Able to judge Good/NG fast with inspection speed of 1sec/FOV and the program can set ROIs conveniently.Performing X-ray inspection in various production site, integrated with other manufacturing equipements.
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Inline AOI Machine
Sherlock-300I
Add PCB inspection to your automated production line, pre- or post-reflow, and speed up your process. Inline Sherlock 300I AOI system inspects components and solder joints on SMT, through-hole and mixed-technology boards and communicates with downstream equipment for automatic good/bad board sorting. The user interface is 100% touch control—as easy to use as a tablet.
