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GaAs pHEMT MMIC Power Amplifier, DC - 28 GHz
HMC994APM5E
The HMC994APM 5E is a GaAs pHEMT MMIC Distributed Wideband Power Amplifier which operates between DC and 28 GHz. The amplifier provides 15 dB of gain, +29 dBm of saturated output power, and 25% PAE from a +10V supply. With up to +38 dBm Output IP 3 the HMC994APM 5E is ideal for high linearity applications in military and space as well as test equipment where high order modulations are used. The HMC994APM 5E exhibits a positive gain slope from 2 to 20 GHz making it ideal for EW , ECM, and test equipment applications. The HMC994APM5E amplifier I/Os are internally matched to 50 Ohms and is packaged in a leadless QFN 5x5 mm surface mount package.
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RS-232
Renesas' RS-232 transceivers are available in many configurations and feature data rates up to 1Mbps, IEC61000 ESD protection, low power shut down modes, and small QFN packages.
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Test Sockets
socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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SMT & QFN Products
PMI offers custom surface mount (SMT) and QFN packaging for many types of devices. SDLVA's, Log Amplifiers, Phase Shifters, Attenuators, Switches, as well as Low Noise Amplifiers. PMI also offers multifunction options in a single QFN package such as Limiter / LNA or LNA / Detector. PMI has the experience to offer custom devices that meet your specific control function at high frequency. Mounting and integrating high frequency RF devices take skill and experience such that the package itself does not degrade the RF signal. PMI has the experience in selecting the proper package, integrating the RF devices and providing the required testing.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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QFN Sockets
With the largest QFN catalog in the world, Plastronics has taken a leadership role in designing and developing socket solutions for the newest QFN packages. These sockets offer a modular design in a small outline with very low inductance. The Open Top QFN socket allows for more convenient package loading and unloading in most of the same lead count options as the lidded version.
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Aspen Sockets
Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
