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Defect Inspection
With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
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Dimensional Metrology System
PINNACLE PLUS
Pinnacle+ Plus elevates Pinnacle performance to the next level. Pinnacle+ Plus features a rigid granite optical support structure and a high performance Z-axis motion assembly to produce the lowest possible uncertainty on micro-electronic parts and assemblies/
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Electro Field Meter
Electrostatic discharge is now a problem in many workstations, as modern microelectronics (integrated devices) are susceptible to damage caused by electrostatic discharge. However, other industries, such as telecommunications, plastics and explosive industries, are also severely affected.
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Microelectronics
Honeywell's trusted foundry of microelectronics provide strategically, radiation-hardened, integrated circuits and technology for aerospace systems and electrical designers to increase performance, reduce risks and ensure mission success in space and in other radiation-prone environments.
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Space
Honeywell’s space portfolio is made up of highly innovative products that span human space missions, launch vehicles, microelectronics and satellite payload and bus technology.
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Intelligent Cable Fault Locator
TM800
TM800 Cable Fault Locator is a portable field instrument working on TDR and bridge methods, adopting advanced micro-electronics technology. It is designed to locate accurate fault points in such cables as telecommunication leadsheathed cable, plastic cable or user’s lead covered wire, while the faults include break, mix, earthing, defective insulation, or poor connecting. It is and ideal function-stable instrument for the field operator to improve work efficiency, in addition, it can also be used for circuitry project checking electric property testing of the cable.
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2-Zone and 3-Zone Vertical Thermal Shock Chambers
FS
Originally developed for testing microelectronic devices for use in military and aerospace electronic systems, Bemco Vertical Thermal Shock Chambers are widely used for screening and quality evaluation of smaller electronic parts.
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Microelectronics Test & Engineering Services
EAG's Microelectronics Test and Engineering lab network provides semiconductor and electronics design firms worldwide with test, debug, and early engineering support to help you with new product introduction. We actively service a broad range of semiconductor and electronics companies worldwide. Services include ATE testing, Reliability testing and qualification, ESD testing, Failure Analysis, FIB Circuit Edit and Debug. for both ICs and systems
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Accelerometor, Gyro, Magnetometer Breakout Board
SEN-38001
The LSM9DS1 is a highly configurable, flexible and precise motion sensing solution from ST Microelectronics - the latest in a wide-ranging inertial product line. It integrates a 3-axis accelerometer, 3-axis gyroscope and 3-axis magnetometer into a single IC , giving you a full nine degrees of freedom (9-DOF) in a tiny 3mm x 3.5mm package. Even with support components, square mounting pattern and connection breakouts for both SPI and I2C, this board is barely the size of a quarter.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Fuse Saver
7611
Peaceful Thriving Enterprise Co Ltd
The device use microelectronic technology to monitor the variation of current, which helps technician to protect the automobile circuit from current overloading during the maintenance.
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Microelectronics And Packaging AOI
Machine Vision Products, Inc. has extensive experience in a wide range of Microelectronics and Packaging applications. MVP works with the world’s leading manufacturers on a global basis. From multiple die and wire technologies to leadframe, ball grid array and surface inspection applications, MVP has the widest applications toolbox of any AOI provider. MVP takes pride in the fact that they supply many complex inspection solutions to diverse industries such as Automotive, Telecoms, Medical Devices, Military, and Space. MVP’s 900 Series is the base platform upon which all Microelectronics and Packaging inspection solutions are based. The 900 series 2D capabilities provide metrology and defect detection using a propriety Quad-Color lighting, Telecentric optics and resolutions down to 1um. 3D height measurement capabilities allow for in-line high speed inspection of Dies, paste deposition, positional accuracy, volume and height with a resolution down to 1.13um.
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Microelectronic Modules
We work in close collaboration with our customers to select the optimal package for an application utilizing the abundance of options, experience and technology from Bourns.
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Manufacturing Services
Systems used in high-performance, safety-critical or mission-critical applications need to incorporate superior microelectronics technology. Often the hardware required is not readily available off the shelf, as particular characteristics or constraints exist that mean a bespoke solution will be necessary. That can add considerable complexity to development projects, so partnering with a recognized specialist in this area is advised.By engaging with Teledyne e2v Semiconductors, you are benefitting from decades’ worth of microelectronics experience - gaining access to a unique to the market one-stop-shop which is capable of developing the technology needed for even the most demanding situations.
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Ion Beam Etch
Nexus IBE Series
Etch precise, complex features for high-yield production of discrete microelectronic devices and components with the NEXUS® Ion Beam Etch (IBE) Systems.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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VIEW
Quality Vision International Inc.
VIEW provides high speed, high precision non-contact measuring systems for manufacturing process control. VIEW’s high performance measuring systems and software are ideally suited for the small feature sizes and complex dimensioning schemes typical of micro-electronic and micro-fabricated parts.
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Microcomputer Six-phase Relay Test Set
Weshine Electric Manufacturing Co., Ltd
It is a new miniaturized microcomputer relay protection tester realized by extensively listening to users' opinions, summarizing the advantages and disadvantages of similar domestic products, and fully using modern advanced microelectronic technology and devices. It adopts the advanced structure of stand-alone operation, and can also be connected to a notebook computer.
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Microelectronics - Integrated Solutions
Teledyne e2v HiRel provides microelectronics packaging and products with a full range of packaging solutions from COTS to MIL-PRF-38534 compliant (Class H & K) qualifications. HiRel provides a one stop solution for your microelectronic assembly, evaluation, test and screening requirements. Our MCM packaging technology enable our customers to meet size, weight, power and cost (SWaPC) requirements without a sacrifice in performance. Our numerous certifications including AS9100, ISO 9001, and MIL-PRF-38534 Class H accreditation, all of which are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers' stringent requirements. We are a DOD Trusted Source for Microelectronics Packaging, Assembly, and Test.
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Microelectronic Packaging
The key to any contract manufacturing project is the development, validation, and implementation of manufacturing processes that will guarantee the quality and reliability of your final product. Teledyne Advanced Electronic Solutions has over 50 years of experience in manufacturing leading edge microelectronic hybrids and modules and has implemented and perfected its core processes to ensure the success of your program.
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Microelectronics
Relates to the study and manufacture of very small electronic designs and components.
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Solid State Relay Products
DARE Electronics? solid state relays incorporate advanced microelectronic hybrid technology and are available from low level to 50 amps. Solid state relays have distinct advantages over electro-mechanical devices including: no contact bounce, arcing or flashing; immunity to contact contamination and oxide formation in dry or normally open circuits; and immunity to shock and vibration thus preventing unwanted contact closures
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Spectrophotometer
Spectromatch Gloss
The new portable Spectrophotometer combines the latest and most advanced technology in micro-electronics and colorimetry.
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Acoustic Microscope
AMI P300
The FastLine P300 Acoustic Microscope is specifically designed for accelerated throughput, semiautomated screening of microelectronic devices on the manufacturing floor.
