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Bond Inspection
Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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AC Ground Bond Testers
440 Series
The 440 Series provides advanced 4-in-1 test capability in a convenient one-box solution. This new series performs AC Hipot (448 - 500 VA), DC Hipot, Insulation Resistance and 40A AC Ground Bond tests while taking up minimal production line space. The 440 Series is simple and easy-to-use; reducing setup time and increasing production line throughput for your application. With multiple memories and an optional USB port for remote BUS communication so you can quickly perform tests on a variety of DUTs from the front panel or with a PC. Learn about our 5 Year Warranty.
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AC Ground Bond Tester
446
Our 446 model is a 4-in-1 tester with AC Hipot, DC Hipot, Insulation Resistance, and Ground Bond capabilities. This tester features a simple design and easy-to-use interface, reducing setup time and increasing production-line throughput for your application. The 446 is equipped with multiple memories and an optional USB port for remote BUS communication so you can quickly perform tests on a variety of DUTs from the front panel or with a PC. Add to user safety by equipping your tester with Personal Protective Equipment (PPE) via the built-in safety interlock.
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Bond Tester
Sigma
Sigma is the most advanced bond tester. It comes with game-changing automation capabilities and high specifications
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Integrated Bonding Systems
EVG offers fully integrated and highly automated production systems for wafer bonding processes. A maximum level of automation and process integration opens the door to large-scale manufacturing and guarantees a proven transition of processes from R&D stage to production.
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Resistance Wire Bonding
Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never ha...show more -
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Earth Bond Test Set
EC-12
The Earth bond test is a basic safety test prescribed in many standards to test samples for the integrity of earthing continuity throughout the sample.
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Ground Bond Tester
264
Our 264 Model makes Ground Bond / High Continuity Testing simple with 40 Amps of current to satisfy your NRTL standard. With an intuitive interface that allows you to set-up a test in seconds and practical security settings, our 264 can easily be deployed in both laboratory and production line environments. Ensure every Ground Bond Test is accurate with our Milliohm offset function.
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Manual Ground Bond Tester
HYAMP
Patented CAL-ALERT® functionElectronic Dwell4-wire measurement and milliohm offsetPatented VERI-CHEK® functionStorage of up to 10 setups with 3 steps per setupBuilt-in Security settingsMinimum and maximum trip settingsInterconnect to Hypot® III to form a complete test systemBuilt-in security settingsLine and Load regulation
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High Voltage Pultruded Resin Bond Glass Fiber Rod
This Test Set-Up can be used to test any kind of Drive Insulator used in Circuit Breaker.
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Ground Bond Tester
HYAMP® Series
HYAMP III includes productivity-enhancing features and proven safety technology to reduce the compliance bottleneck on the production line. All models verify the integrity of your product's ground circuity with accurate 4-wire measurements and offset capability.
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Ground Bond Tester,
266
Our 266 Model makes Ground Bond / High Continuity Testing simple with 60 Amps of current to satisfy your toughest NRTL standard. With an intuitive interface that allows you to set-up a test in seconds and practical security settings, our 266 can easily be deployed in both laboratory and production line environments. Ensure every Ground Bond Test is accurate with our Milliohm offset function.
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xDSL with Channel Bonding Handheld Teste
The ARTISAN xDSL with Bonding handheld tester is a powerful and comprehensive ADSL and VDSL Test solution. The AutoTest feature makes testing standard and Channel Bonded lines simple and keeps training needs to a minimum. Features such as 7” colour touchscreen, Web Browser, Histograms for monitoring longer term intermittent faults and industry leading Broadcom chipset puts the Vonaq ARTISAN xDSL Tester ahead of the pack.
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Multimode Bond Tester
BondMaster 600
The BondMaster® 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications.
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Fusion Bonded Cable Jumpers
Series 152FB
Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
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Bond Alignment Systems
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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Bond Tester
Sigma Lite
Sigma lite is a low cost of ownership bond tester that grows with your company. It gives you a low-cost entry point without sacrificing performance to meet future demands.
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Temporary Bonding andDebonding Systems
Increased demand for applications based on thin wafers and thin microelectronic-substrates result in the need for processing and handling of thin- and ultra-thin substrates during the manufacturing step. Thin substrates in the area of IC manufacturing (like memory, CMOS, 3D-TSV integration or ChipCard applications), power devices (e.g. IGBTs), compound semiconductors (e.g. for high brightness LEDs or RF-power amplifiers), as well as emerging technologies that also involve thin or flexible substrates (MEMS; RFID-tags, flexible displays, etc.) require reliable handling and support techniques in order to ensure safe processing.
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Scott Internal Bond Impact Tester
The Scott Internal Bond Impact Tester is used to determine tear resistance (Elmendorf). A sample is torn with the help of the pendulum device starting from a predetermined cut. The work required for a tear of a given length is measured.
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Ground Bond Tester
260 Series
Our 260 Series makes Ground Bond testing simple. We offer two models so that you can have a simple and easy-to-use Ground Bond tester that provides the output current you need to satisfy NRTL specifications. With an intuitive interface that allows you to set-up a test in seconds and practical security settings, our 260 Series can easily be deployed in both laboratory and production line environments.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controll...show more -
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Guardian Ground Bond Tester
19572
Chroma Systems Solutions, Inc.
Wide resistance measurement range : 0.1 ~ 510 mΩHigh performance AC current output : 45 ACompact size ground bond testerProvide reliable and stable test resultsBuilt-in resistance compensation functionStandard RS-232 interfaceOptional GPIB InterfaceCompatible with the model 19070 series Hipot Tester2-Year factory warranty
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Bond Testing
Our complete line of bond testing (BT) flaw detectors provides unmatched capabilities for the location of discontinuities and other flaws in composite structures. We offer a wide range of measurement features and application-specific options for flaw detection.
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Bonding Ohmeters
bonding ohmmeter is an affordable, highly accurate, and intrinsically safe electrical bond tester. This meter is capable of performing bond measurements on a variety of components and metal-to-metal connections. The 620LK has been independently UL-913 certified, ensuring quality and safety at each step of manufacturing. Due to its safety certifications and high level of accuracy, the 620LK meter is the choice bond tester for many commercial airliners, while its sibling the 620UK-B is in countless USAF programs.
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High Force Large Area Bond Tester
Sigma HF
- For high force and large area- Typically for IGBT, power modules and batteries up to 1000 kgf- High axis speed- Deep access up to 80 mm- SEMI S2 safety cabinet with visual feedback- Flexible positioning of multiple work holders
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AC Hipot w/ Ground Bond Test Capability
HypotULTRA® Series
In a world where data is king, HypotUTLRA improves traceability with on-board data storage and allows you to automate hipot testing with a variety of communication interfaces. Increase efficiency with our direct barcode scanner connection and intuitive touch screen interface. Models 7804 and 7854 are a 4-in-1 solution with the addition of 40A AC Ground Bond test capability added to HypotULTRA's already impressive feature list. HypotULTRA is a dielectric analyzer designed to take your production line to the next level.
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AC Ground Bond Tester
448
Our 448 model is a 4-in-1 tester with 500VA AC Hipot, DC Hipot, Insulation Resistance and Ground Bond testing capabilities. The 448 is capable of a 500VA AC Hipot output to comply with 100mA leakage current test compliance requirements. This tester features a simple design and easy-to-use interface, reducing setup time and increasing production-line throughput for your application.
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Post Wire and Die Bond Inspection Machine
IV-T3300
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
