- Applied Rigaku Technologies, Inc
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Small Spot Advanced EDXRF Spectrometer
NEX DE VS
Applied Rigaku Technologies, Inc
Specially designed and engineered for heavy industrial use, whether on the plant floor or in remote field environments, the superior analytical power, flexibility, and ease-of-use of the NEX DE VS adds to its broad appeal for an ever-expanding range of applications, including exploration, research, RoHS inspection, and education, as well as industrial and production monitoring applications. Whether the need is basic quality control (QC) or its more sophisticated variants — such as analytical quality control (AQC), quality assurance (QA) or statistical process control like Six Sigma — the NEX DE VS is the reliable choice for routine elemental analysis.
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Smart Inspection Station
SiS
Smart Inspection Systems LLC was born in 2010 in response to orthopedic manufacturers’ demands for faster inspection than their sister industries. Our signature product, the Smart Inspection Station™ (SiS™), is an automated turnkey inspection solution that yields comprehensive visual reports with complete geometric form and dimensional pass/fail in just minutes. The SiS™ is custom-configured per the client’s needs, yet versatile enough for simultaneous commissioning on multiple product lines. ...show more -
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Packaged Food X-ray Inspection System
EPX100
Our revolutionary new x-ray system is so advanced it will not only improve your product safety and meet regulatory compliance but also will optimize and streamline your product inspection.
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Wide Range Film Inspection
790
For a wide range of coatings the easy-carry and easy to handle SPY Model 790 speeds inspection time with its built in Jeep meter and various other time saving and comfort features
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Inspection Scope
KI-TK1010
Inspection scope & cleaning materials for SC, FC, ST connectors, universal 2.5 mm & 1.25 mm ferrules (LC / 1.25 mm option)
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Scanning & Inspection
API’s offers a range of portable measuring and laser scanning solutions together with robot or tripod mounted 3D structured light scanner.
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Bond Inspection
Increasingly thin wires, finer pitches, as well as more applications of thick wire for higher capacities are among the current trends in wire bonding. At the same time, the requirements for robust and defect-free bonds are increasing, for example in assistance systems in the automotive sector and in RF modules in the 5G mobile communications network. This makes reliable inspections extremely important.
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Inspection Toolkit
OTK-4000
The Inspection Toolkit contains selected tools for verifying the existence of threatening electronic surveillance devices.
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Defect Inspection
With over 20 years of experience in defect inspection, microelectronics manufacturers around the world partner with us to improve yield by performing high-speed, automated inspection and then transforming the defect data into actionable process control with powerful analytical software.
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Concrete Inspection
Concrete structures are normally constructed using steel reinforcement and Elcometer offers Concrete Covermeters and Rebar Locators to either measure the depth of concrete over the rebar or simply to detect the rebar under the surface. Half-cell versions of the Covermeter can be used to assess the probability that corrosion is taking place on the rebar. Test Hammers are used to assess the surface hardness of cured concrete and Elcometer offers several moisture meters that can be used to determine if the structure is sufficiently dry for coating.
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X-Ray Inspection System
TruView™ Fusion
The quality of your products is paramount to the success of your business. The TruView™ Fusion X-ray Inspection System allows you to "see inside" your products without destroying them, enabling unprecedented understanding of your manufacturing process. The TruView™ Fusion X-ray is the right solution if you are looking for a radiography system to inspect medical devices, printed circuit boards, electronic components, and mechanical parts.
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X-Ray Inspection System
MXI Quadra 5
Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Video Inspection
MacroZoom
Our MacroZoom Video Inspection packages are useful is countless industries. MacroZoom solves the problems that customers have with traditional microscopes, by offering an unlimited working distance, as well as field of view, and hugely generous 1-80x magnification range.
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Optical Inspection Machine
3D AOI
3D AOI latest optical inspection machine 1. No part dead angle, 4-way projection, complete measurement 2. Part height measurement, accurate measurement of defects 3. Multi-piece inspection without additional program 4. DLP digital projection, program editable height measurement
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Pipeline Inspection
Radiodetection and Pearpoint provide a wide array of Pushrod and Crawler pipeline inspection systems.
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Macro Inspection
High-throughput automated macro inspectionAny wafer size, in less than one second with ~75 micron resolutionSmall footprint table-top system
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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Automated Optical Inspection
AOI
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks perf...show more -
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Baggage and Parcel Inspection
Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Thickness and Flaw Inspection
OmniScan MX2
The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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Appearance Inspection
We perform quality assurance agency of customers' important products through inspection.
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Magnetic Particle Inspection
Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Inspection
A complete line of testing instruments for inspection laboratories is available from our Petrolab group. We specialize in instruments for vapor pressure, flashpoint, distillation, and color as well as equipment for hundreds of other ASTM, ISO, and DIN testing procedures. Below are a handful of items we offer.
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Thickness and Flaw Inspection
NORTEC 600
Olympus converges its latest advancements in high-performance digital circuitry and eddy current flaw detection into one compact and durable portable unit—the new NORTEC® 600. With its crisp and vivid 5.7 inch VGA display and true full-screen mode, the NORTEC 600 is capable of producing highly visible and contrasting eddy current signals in any lighting condition.
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Wafer Inspection System
INSPECTRA® Series
INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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IR Inspection System
EVG®20
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Ultrasonic Inspection System
PULD 40
The PULD-40 is a versatile and highly accurate ultrasonic inspection system designed to meet the needs of our customers.
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Fiber Inspection and Cleaning
Dust - just because you can't see it doesn't mean it's not there. A 1-micrometer dust particle on a single-mode core can block up to 1% of the light (a 0.05dB loss). The only way to know it's clean is to inspect it before you connect it. And if it's dirty, it needs to be cleaned with the right tools or you might just make it worse. Know it's clean with our cleaning and inspection tools.
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WiFi Inspection Cameras
WiFi Inspection Cameras generates a local WiFi hotspot (without Internet access) through which video clips and still photos of hard-to-reach or hard-to-see areas or equipment captured by the probe camera can be sent to an app-enabled smartphone or tablet for viewing and sharing. Free apps for iOS devices (iPhones or iPads) and Android devices are available from the iTunes App Store and Google Play Store, respectively. The three WiFi cameras differ in probe length, camera lighting and grip style.
