Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
- Pickering Interfaces Inc.
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PXI Low-Leakage Switched Guard Switching Solutions
They are based on the switched guard design principle, and the overall designs assure isolation resistances of up to 1013Ω. This high level of isolation resistance ensures accurate and reliable measurements, making our products ideal for high-precision semiconductor testing.
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Total Organic Carbon Monitor
HT-110
The continuous online TOC-Analyzer HT-110 is suitable for the measurement ot total organic carbons in Purified Water (PW), Water For Injection (WFI) and Highly Purified Water (HPW). The unit is operating according to USP 643. It is applicable for pharmaceutical and/or semiconductor manufacturing. The measuring principle is based on UV-Oxidation and measurement of the difference in conductivity. TOC concentration measurement (TOC concentration 500 ppbC or lower) is necessary to perform quality control according to GMP (Good Manufacturing Practice).
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Mixed Signal Test Systems
MTS2010i
The MTS-2010i are a cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
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Relays & Contactors
Panasonic Industrial Devices Sales Company of America
Relay options include Panasonic's exclusive PhotoMOS® Semiconductor Relays (otherwise known as Photo, Photo Voltaic, Solid State or MOS-FET Relays) along with Power, Signal, Automotive and High Frequency Relays.
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Power Semiconductor Device
IGBT/SIC
Hitachi High Voltage IGBTs have been corresponding to a wide range of applications such as railway applications and various power conveters, leading companies for domestic and overseas adopt them, since they were adopted as a railway application in 1992. Will continue to contribute to the developing energy society by pursuing more easy-to-use, high-performance and high -quality products with leading-edge research and development.
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Magnetic & Current Sensors
From the International Space Station to a simple electronic compass, we can provide a solution to meet your magnetic semiconductor needs. The F.W. Bell® product line was founded in 1944. Since then we have been a pioneer in developing instrumentation to measure electric current and magnetic fields.
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5.0 MP NVIDIA® Jetson Xavier™ NX/NVIDIA® Jetson Nano™ Camera
E-CAM50_CUNX
e-CAM50_CUNX is a 5.0 MP MIPI CSI-2 fixed focus color camera for NVIDIA® Jetson Xavier™ NX/NVIDIA® Jetson Nano™ developer Kit. This camera is based on 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® with built-in Image Signal Processor (ISP). This powerful ISP helps to brings out the best image quality from the sensor and making it ideal for next generation of AI devices.
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Measurement System
DPS
EYCOM develops and manufactures highly accurate and dependable measurement systems for permittivity, dielectric loss tangent, or permeability by leveraging its accumulated experience and expertise over a long period of time. Capitalizing on such experience and expertise, KEYCOM is committed to developing customized solutions for wide range of specific applications such as flexible circuit board, semiconductor, thin film, millimeter wave and microwave frequency board,
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Confocal Sensors (White Light)
confocalDT
The confocal chromatic confocalDT measuring system is used for fast distance and thickness measurements. Different sensor models and controller interfaces open versatile fields of application, e.g., in the semiconductor industry, glass industry, medical engineering and plastics production.
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Semiconductor Test Platform
PAx
PAx semiconductor test system delivers uncompromised RF performance in a low-cost system for testing RF power amplifiers and front-end modules for next-generation wireless standards.
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Nano-focus X-ray Inspection System
X-eye NF120
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Semiconductor Thermal Analyzers
Analysis Tech Semiconductor Thermal Analyzers measure semiconductor junction temperatures using the electric method of junction temperature measurement on all types of semiconductor devices.
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Meters For Contact Angle And Surface Tension + Semiconductor Technology, Micro Scriber
SURFTENS HL Automatic
Optik Elektronik Gerätetechnik GmbH
Fully automatic contact angle meter for silicon wafers up to 12 inch The contact angle measuring system SURFTENS HL automatic is designed for use in semiconductor industry and research, in particular for process control of wafer coating and in the photolithographic process.
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Constant Temperature Humidity Test Chamber
Constant Temperature and Humidity Test Chamber from Weiber are environmental test chambers, designed to simulate constant climatic conditions for testing a wide variety of products for their quality, performance, shelf life and stability. They are used to simulate constant temperature and humidity conditions, thereby creating a physiologically ideal environment for product testing. These equipments are most commonly employed for testing electrical devices, electronic parts and components, instru...show more -
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Portable Voltage and Current Instruments
Each model in our portable test equipment range is designed for accuracy and reliability, providing high performance and ease of use for applications. Products are used in various lab and field applications across industries such as research and development, semiconductor, and process control. For higher range electrical source and measure we have a series of bench multifunction calibrators and multimeters.
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IC Testing System
Is a system for giving electrical signals to a semiconductor device to compare output signals against expected values for the purpose of testing if the device works as specified in its design specifications.
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Burn-In Test
Trio-Tech provides a comprehensive range of semiconductor testing services through its state-of-the-art laboratories in the Far East. The laboratories provides static and dynamic Burn-in /HTOL /SLT testing and other testing services. All of the company’s testing facilities are ISO9001, ISO14000, ISO17025 and DSCC certified ensuring that operating policies and procedures meet stringent international standards for consistency and reliability.
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Probe Card
Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Semiconductor Test
Tecap SPACE offers all the functions necessary to control test systems (ATE) for the semiconductor test. Tecap is hardware-independent and can be used with all customer-specific concepts.
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Front & Backside, Semi-Automatic Mask Aligner
Model 800E
The OAI Model 800E front and backside, semi-automatic mask aligner system offers advanced features and specifications found most often in costly automated production mask aligners. With the development of this mask aligner, OAI meets the growing challenge of the dynamic semiconductor and MEMS market with a new class of mask aligners that are engineered for R&D and low volume production.
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Device Modeling Products
Our products and premier solutions provide for characterization and modeling of cutting-edge CMOS and compound semiconductor devices. Keysight is the only vendor that provides complete end-to-end modeling solutions, from automated measurements, accurate device model extraction, comprehensive qualification to final process design kit (PDK) validation. Comprehensive modeling services are offered, supported by Keysight's expert engineers and advanced labs. Our key device modeling and characterization EDA software and hardware solutions are included below.
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Semiconductor
Scientific Computing International
Materials which have a conductivity between conductors (generally metals) and nonconductors or insulators
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Global Design Platform
IC Manage Global Design Platform (GDP, GDP-XL) is the semiconductor industry’s most advanced, design & IP management system.
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Non-Dispersive Infrared Monitors
OPTI-Sense Series
Teledyne Advanced Pollution Instrumentation
The OPTI-Sense series of sensors is based on Non-Dispersive Infrared (NDIR) technology. They are designed to precisely measure the absorbance in the infrared spectrum of specialty gases typically found in semiconductor applications. They are very compact and designed with no moving parts, making the OPTI-Sense robust and ideal for continuous in-situ gas monitoring of semiconductor processes.
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Fiber Sensors
Easy to install.Numeric displays, interactive prompts.Applications focus on many industries,such as semiconductor assembly, handling technology and packing.Depends on the mounting direction, the digital display of BR1 can be inverted.Response time selectable:(20050010005000)s.
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Laser Head
5517DL
The Keysight 5517DL is used primarily in VME and PC based laser interferometer systems where the velocity of motion is faster, such as semiconductor lithography and flat panel applications. Please contact Keysight for custom requirements.
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Capacitor to Dim
DAM1
Lifasa - International Capacitors, SA
DAM switching capacitors are used to protect semiconductors (IGBT transistors). These are charged and discharged repeatedly with high current peaks. This series is especially indicated for applications that require high capacities at high voltages.
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Metrology
Optical critical dimension (OCD) metrology and film metrology require accuracy and repeatability. Onto Innovation's techniques are well-established and trusted by semiconductor manufacturers around the globe.
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LED Illumination
Semiconductor device that emits visible light when an electrical current passes through it.
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EBAPS Technology
Intevac's EBAPS technology is based on a III-V semiconductor photocathode in proximity-focus with a high resolution, backside-thinned, CMOS chip anode. The electrons emitted by the photocathode are directly injected in the electron bombarded mode into the CMOS anode, where the electrons are collected, amplified and read-out to produce digital video directly out of the sensor.
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Bonding Tester
PTR1102
In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
