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Fiber Optics Bridge Card
DP8000
Guzik DP8000 Fiber Optics to PCIe® bridge / FPGA Accelerator Card, enables evolving markets such as High-speed Data-acquisition, High Performance Computing to take advantage of the latest Optics and DDR4 technology. The card provides up-to 24 bi-directional optical links with total user data bandwidth greater than 40 GB/s (320 Gbps) through the Samtec FireFly™ protocol-agnostic embedded optical engines.
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Machine Vision Computer with Built in I/O
Neousys Nuvis
Nuvis-5306RT , Nuvis-534RT, Nuvis-7306RT contain interfaces for connecting to all necessary devices: LED lighting controller, camera trigger, encoder input, PWM output and digital I / O lines.- Intel® 7th Gen Core ™ i7 / i5 65W / 35W, up to 32GB DDR4- Built-in I / O- 4-CH CC / CV backlight controller- 4-CH trigger camera- 1-CH quadrature encoder input- 8-CH isolated DI and 8-CH isolated DO- Built-in camera interfaces- 4-CH IEEE 802.3at Gigabit PoE + ports- 4-CH USB 3.1 Gen1 ports- NVIDIA 75W GPU Support
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Machine Vision SBC With AMD® Ryzen™ Embedded V1807B And V1605B APU, DisplayPort, HDMI, 2 GbE LAN, 2 IEEE 802.3at PoE GbE LAN And Vision-specific I/O
MIRU130
*AMD® Ryzen™ Embedded V1807B and V1605B APU*2 DDR4 SO-DIMM for up to 16GB of memory*2 GbE LAN and 2 IEEE 802.3at PoE GbE LAN*2-CH camera trigger outputs*2-CH LED lighting control*1-CH incremental quadrature encoder input*4 isolated DIO
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Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, VGA, EDP, USB 3.0, M.2 And Dual GbE LAN
MANO523
*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor*Intel® Q370 chipset*2 DDR4 SO-DIMM for up to 32GB of memory*4 USB 3.0 and 4 USB 2.0*6 COM ports*2 SATA-600 and 1 M.2 Key M*PCIe x16 and M.2 Key E
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Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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PCIe FPGA Carrier For FMC+, Altera Arria-10 GX1150
PCI536
The PCI536 is based on the Altera Arria-10™ GX1150 FPGA in F1517 package. The FPGA interfaces directly to the FMC+ DP 0-23 (single connector) and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 modules. The PCI536 has x8 PCIe edge connector routed to the FPGA PCIe Gen3 hard IP block. It also has interface to two DDR4, 64-bit wide, with 16 GB total memory. This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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PCIe FPGA Carrier For FMC+, Kintex UltraScale™
PCI592
The PCI592 is based on the Xilinx XCKU115 Kintex UltraScale FPGA, which provides 5,520 DSP slices, 75.9 Mb RAM and 1,451,000 logic cells. The FPGA interfaces directly to the FMC+ DP-23 and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 modules. It also has interface to three DDR4 memory channels (2x 64-bit wide and 1x 32-bit wide). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. The unit has x8 PCIe edge connector routed to the FPGA PCIe Gen3 hard IP block. In addition, 16 uncommitted connection pairs are routed to a dual x8 expansion connector, providing direct connectivity to a neighbouring FPGA (e.g. via Aurora, 10G/40G, SRIO, PCIe) without the need to go through the host.
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PCIe FPGA Carrier For FMC, Virtex UltraScale™
PCI595
The PCI595 is based on the Xilinx XCVU440 Virtex UltraScale FPGA, which provides 2,880 DSP slices, 88.6 Mb RAM and 5,541,000 logic cells. The FPGA interfaces directly to the FMC DP 0-9 and all FMC LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 modules. It also has interface to one DDR4, 64-bit wide, with 8 GB total memory. This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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PCIe FPGA Carrier For FMC+, VU13P UltraScale+TM
PCI596
The PCI596 is based on the Xilinx VU13P UltraScale+TM FPGA, which provides over 12,000 DSP slices, 360 Mb of UltraRAM and 3,780K logic cells. The FPGA interfaces directly to the FMC+ DP 0-31 and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 and VITA 57.4 modules. It also has interface to DDR4 memory channels (1x 64-bit wide, 8 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. PCI596 has x16 PCIe edge connector routed to the FPGA PCIe Gen4 hard IP block. In addition, 16 uncommitted connection pairs are routed to a dual x8 expansion connector, providing direct connectivity to a neighbouring FPGA (e.g. via Aurora, 10/40GbE, SRIO, PCIe) without the need to go through the host.
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PCIe VU13P UltraScale+TM With Massive Optical I/O
PCI597
The PCI597 is based on the Xilinx VU13P UltraScale+TM FPGA, which provides over 12,000 DSP slices, 360 Mb of UltraRAM and 3,780K logic cells. The Unit provides active cooling of the FPGA making it appropriate for power-hungry applications or those requiring temperature stability for good performance. The FPGA has interface to DDR4 memory channels (single bank of 64-bit wide, 16 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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Rugged Blade Processor W/ Dual Xeon E5
ATC126
The ATC126 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with up to eight banks of 256 GB DDR4 memory with ECC. Versatile connectivity includes two 10/40GbE Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector.
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Semiconductor Interconnect
Materials that are usable in all backend BI/reliability applicationsHigh IO count capabilityFine pitch down to 0.25 The industry’s smallest DDR4 and DDR5 socket outlineAdvanced plating technologies and custom outlines
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SOM Module
TEO820-ZU2CG
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784EZU2, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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SOM Module
TEO820-ZU4EV
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
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SOM Module
TEO820-ZU3EG
Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784EZU3EG (optional ZU5EV) 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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VPX SBC
SBC3511 3U
The SBC3511 is based on the new, highly integrated Intel® Xeon® E-2276ME 6-core/12-thread processor ('Coffee Lake Refresh') which operates at 2.8 GHz with TurboBoost up to 4.5 GHz, 64 GB of DDR4 RAM and the inclusion of up to 256GB of NVMe SSD, providing increased platform performance and throughput.
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Xilinx Kintex UltraScale SoM
TE0841
Sundance Multiprocessor Technology Ltd.
The Trenz Electronic TE0841 is an industrial-grade FPGA module integrating a Xilinx Kintex UltraScale KU35 or KU40 with 2x banks of 16-Bit width 512Mbtyes DDR4 SDRAM, max 256 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.
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Xilinx Zynq UltraScale+ SoM
TE0808-ZU9
Sundance Multiprocessor Technology Ltd.
The Trenz Electronic TE0808 is an industrial-grade SoC module integrating a Xilinx Zynq UltraScale+, max. 4 GByte DDR4 SDRAM with 32-Bit width, max. 512 MByte Flash memory for configuration and operation, up to 256 MByte HyperFlash, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.
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1-Ch 3.6 GHz or 2-Ch 1.8 GHz 12-bit A/D with DDC, Kintex UltraScale - PCIe
Model 78841
Ideal radar and software radio interface solution Supports Xilinx Kintex UltraScale FPGAs One-channel mode with 3.6 GHz, 12-bit A/D Two-channel mode with 1.8 GHz, 12-bit A/D Programmable one- or two-channel DDC (Digital Downconverter) 5 GB of DDR4 SDRAM µSync clock/sync for multiboard synchronization PCI Express (Gen. 1, 2 & 3) interface up to x8
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LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI
ASMB-816
- LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor- DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory- Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1- Intel® X550 dual 10GbE ports- Eight SATA 3 and one M.2 connectors (SATA/PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
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ATCA PCIe Rugged Processor With Dual Xeon E5-26xx V4
ATC127
The ATC127 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with eight banks of memory up to 256 GB DDR4 memory. Versatile connectivity includes two PCIe Gen3 x16 Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector. Onboard mSATA storage is available for local boot.
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ATCA Rugged Blade Processor With Dual Xeon Cascade Lake-SP
ATC128
The ATC128 is a high performance ATCA processor blade featuring dual 24 core Intel® Xeon® processors, each with six banks of memory providing up to a total of 384 GB DDR4 memory with ECC.
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ATCA Rugged Blade Processor With Dual Xeon Cascade Lake-SP, 100G Ethernet
ATC129
The ATC129 is a high performance ATCA processor blade featuring dual 24 core Intel® Xeon® processors, each with six banks of memory providing up to a total of 384 GB DDR4 memory with ECC.
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COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Analyzer Probes
The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
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Multi-site Module Testing System
TCIII-3200ST
TurboCATS introduces a new line of redesigned TCIII-3200ST DDR4 and DDR3 multi-site module testing system - compact, high-performance, and equiped with enhanced productivity features. The TurboCATS TCIII-3200ST module test system features an optional 8, 16 or 64 module testing, in parallel, for high throughput on your production floor.
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DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
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Memory Tester for DDR4 DIMMS
RAMCHECK LX
USBWith the RAMCHECK LX DDR4 memory tester package (part number INN-8686-DDR4) you can quickly test and identify DDR4 DIMMs that comply with JEDEC standards. Tests are fast, reliable and easy to do. The RAMCHECK LX DDR4 package includes the RAMCHECK LX base tester and 288-pin DDR4 DIMM adapter. (This package is also available with the DDR4 DIMM Pro adapter, featuring a very rugged test socket).
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DDR4 Pro Memory Test Adapter
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
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Quad Cortex A72/4GB DDR4
QLS1046
The QLS1046-4GB is the first solution from Teledyne e2v that integrates a QorIQ® processor built on the ARM® Cortex A72 cores, offering increased compute with decreased power consumption combined with multiple connectivity options.
