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Mid-end
Growth in the advanced packaging market and the challenges raised by the various packaging types requires the highest level of inspection and metrology, ensuring high yields of each die as well as of the whole package.
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Open-source CAD tool to simulate 2D and 3D-ICs.
IntSim v2.0
Simulate and optimize 2D and 3D-ICs. Pre-silicon estimates for die size, number of metal levels, size of each metal level and chip power.
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Ultra Broadband SSPA
Exodus Advanced Communications
Exodus Chip & Wire Hybrid ultra broadband amplifiers feature GaN, GaAsFET discrete die on ceramic substrate covering frequency ranges from 4GHz to 26.5GHz and power levels exceeding 500W.
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Wafer Test
Silicon Turnkey Solution, Inc.
Most foundries provide wafers already probed to a set of DC parameters at room temperature to ensure they meet a basic subset of the package-part specification. Beyond this basic set of tests, more rigorous testing is often needed to meet specifications requiring die to be 100 percent probed, identify and segregate devices with higher performance levels and guarantee that parts will perform to a certain specification level.
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Ultrasonic Generators
F&K Physiktechnik develops and manufactures fully digital ultrasonic generators. Ultrasonic power levels are available for fine wire bonding as well as for heavy wire and die bonding applications. All generators could be used with our ultrasonic transducers, but also with third party transducers.
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Probe Series
CAPELLA Series
MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Gas Analysis
Our infrared gas detectors provide superior sensitivity and reliability that may be translated into a more effective early warning system when monitoring atmospheres for gases at trace levels. Our technology also offers the opportunity to perform sophisticated gas analysis. One example: To assure personal safety during a medical procedure, our gas detectors deliver a precise monitoring of the ratio of exhaled gases of a hospital patient who is under general anesthesiology. Another example, no canary need die in a mine if Dexter gas detectors are installed on the job. Infrared lead detectors, whether mobile or mounted, can be a critical element in your health and safety strategy at home and on the job, whatever life forms it is your responsibility to protect.
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Wafer/Chip/Package Semi-automated ESD Tester
400SW
Tokyo Electronics Trading Co., Ltd.
Semi-automated ESD tester featuring Ecdm 400E, Universal ESD Simulator. Used with a manual wafer probing system or a die manipulator, wafer or die level semi-auto ESD test can be done, as well as packaged device test. Damage is detected by V-I curve or leakage current change detection. Stress level and measurement points are programmed by personal computor via GP-IB. Once test terminals are selected, ESD endurance is automatically measured.
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Local and Lattice Stress Measurement
127 Raman
Local and Lattice Stress Measurement, Die level Topography for in-die and in-device stress and composition control.
