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Infusion Device Analyzers
Dual Channel with unique "Synchro-Start" function optimize IV Pump and Analyzer accuracyTest all types of pumps dual-rate, pulsatile flow, and PCA infusion pumpsAutosequence editing, plus test results
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Multivariate Analysis and Experimental Design Software
The Unscrambler
Analytical Spectral Devices, Inc.
The Unscrambler software from Camo Software is a complete Multivariate Analysis and Experimental Design software solution, equipped with powerful methods including PCA, Multivariate Curve Resolution (MCR), PLS Regression, 3-Way PLS Regression, Clustering (K-Means), SIMCA and PLSDA Classification etc.
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RFID
HF (13.56 MHz)
BIS M uses the high frequency (HF) 13.56 MHz and supports the standard according to DIN ISO 15693 and 14443. Communication modules/gateways are used for the point-to-point or bus linking and are directly connected to a serial interface of a PC/a bus interface. The Subnet16 TM bus architecture supports a subnet of up to sixteen nodes via an RS485 interface.
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Sample Conditioner
PCA-400
Bacharach’s active sample conditioner is used to enhance the performance of the PCA® 400 combustion and emissions analyzer in heavy industrial and commercial settings. The PCA® 400 provides accurate readings for CO, O2 and NO with a standard probe. Bacharach also offers optional Viton™ tubing with the sample conditioner to eliminate sample dropout, ensuring accurate results in applications where NO2 and SO2 measurements are necessary. The sample conditioner removes water vapor from the stack gas...show more -
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Thermal Load Boards
Thermal Engineering Associates, Inc.
A Thermal Load Board (TLB) is used to simulate an application printed circuit assembly (PCA) either before all the heat-producing components are available for mounting on the application PCA or if the heat-producing components require complex electronic circuitry to create heat within the components. The TLB is typically designed to be as mechanically and thermally equivalent to the application PCA and usually offers a way to vary the power dissipation of the elements that simulate the heat-producing components.
