COM-HPC Server Type Modules
ADLINK Technology Inc. (ADLINK)
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
Computer on Module
- COM-HPC
- COM-HPC Server Type Modules
- COM-HPC Client Type Modules
- COM-HPC Mini Type Modules
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COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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COM-HPC Server Type Reference Carrier Board in Extended ATX Form Factor
COM-HPC Server Base
The COM-HPC Server Base is an extended ATX size COM-HPC Server Type reference carrier board based on PICMG COM-HPC Revision 1.0. Together with the COM-HPC Server Type module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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COM-HPC Server Type Size E Reference Development Platform based on Ampere® Altra® SoC
Ampere Altra Developer Platform
Backed by a broad Arm® ecosystem with an Ampere® Altra® SoC at its core, using the Arm® Neoverse™ N1 platform, the Ampere Altra Developer Platform provides premium performance from a cloud-to-edge infrastructure, keeps an extremely low thermal envelope, lower TCO, and significantly lower power consumption than x86 designs. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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COM-HPC Server Type Development Kit based on Ampere® Altra® SoC
Ampere Altra Dev Kit
Ampere Altra Dev Kit consists of a COM-HPC Server Base carrier paired with a COM-HPC Server Type Size E module and heatsink with fan. The module features Ampere® Altra® SoC (Arm Neoverse N1-based architecture) harnessing 32/64/96/128 Arm v8.2 64-bit cores for up to 1.7/2.2/2.8/2.6 GHz and providing support for up to 768GB DDR4 memory, offering unprecedented performance and power per watt with exceptional scalability.
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Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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COM-HPC Server Type Ice Lake-D Starter Kit
The COM-HPC Server Type Starter Kit consists of a COM-HPC Server Type module, memory, and thermal solution of your choice with an extended ATX size COM-HPC Server Type reference carrier board, as well as necessary cabling. It allows you to quickly emulate the functionality of your end product for software development and hardware verification. Carrier board design files (schematics, mechanical drawings), COM-HPC module drivers, BSP, and user manual are also offered to aid you in designing your own custom carrier board.
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COM-HPC Server Type 10G OCP Mezzanine Card
OCP-4x10G-SFP+
- Supports up to four 10GbE Fiber interface (10G-SFP+)- Compatible with PICMG COM-HPC Rev 1.0 Server Type compliant- For COM-HPC-ALT module
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COM-HPC Server Type 10G OCP Mezzanine Card
CEI-4x10G-SFP+
- Supports up to four 10GbE Fiber interface (10G-SFP+)- Compatible with PICMG COM-HPC Rev 1.0 Server Type compliant- For COM-HPC-sIDH module
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COM-HPC Server Type 10G OCP Mezzanine Card
CEI-4x10GBASE-T
- Supports up to four 10GbE copper interface (10GBASE-T)- Compatible with PICMG COM-HPC Rev 1.0 Server Type compliant- For COM-HPC-sIDH module
