Akrometrix, llc
Akrometrix' mission is to lead the industry in non-contact surface measurement tools. Based on a culture of innovation and fairness, the company is dedicated to building its global presence by designing its operations and products from our customers' perspective.
- 404-486-0880
- 404-486-0890
- Sales@Akrometrix.com
- 2700 NE Expressway
Building B, Suite 500
Atlanta, Georgia 30345
United States
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product
Akrometrix Software Suite
Studio Platform
Akrometrix Studio is an advanced set of integrated software modules that work together to run all Akrometrix equipment. The Studio software suite takes users from profile creation, through warpage measurement, temperature profiling, analysis of warpage data, and reporting seamlessly. Studio software users will have nearly the same experience in working with different Akrometrix measurement technologies and different Akrometrix measurement tools.
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product
Thermal Warpage and Strain Measurement Tool
PS200S
The TherMoir PS200S is a metrology solution that utilizes the shadow moir measurement technique combined with automated phase-stepping to characterize out-of-plane displacement forsamples up to 150 mm x 200 mm. With time-temperature profiling capability, the TherMoir PS200S captures a complete history of a sample's behavior during a user-defined thermal excursion.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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product
Software
Part Tracking
Part Tracking technology is a software application included in Akrometrix Surface Measurement that increases system throughput while reducing user to user and system to system measurement variation. Part Tracking uses edge recognition technology to locate a part in space and automatically crop/rotate the sample for processing of the found surface area.
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Software
Interface Analysis
Surface-mount components warp during the reflow process, and the area where they attach also changes shape during assembly. This interface between components is where solder, paste, and gaps created due to thermal expansion combine to create 100% good products, or defects such as Head-in-Pillow, Shorts, and Opens. Fully understanding that critical interface between surfaces is more important than ever.
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Thermal Warpage Measurement Tool
PS600S
The TherMoir PS600S is a metrology solution that utilizes the shadow moir measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 600 mm x 600 mm. With time-temperature profiling capability, the TherMoir PS600S captures a complete history of a sample's behavior during a user-defined thermal excursion.
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Thermal Warpage Metrology Tool
AXP 2.0
The TherMoiré® AXP 2.0 is a modular metrology solution that utilizes the shadow moiré measurement technique, combined with automated phase-stepping, to characterize out-of-plane displacement for samples up to 400 mm x 400 mm. With time-temperature profiling capability, the TherMoiré® AXP 2.0 captures a complete history of a sample’s behavior during a user-defined thermal profile.
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Vision Measurement Technologies
Some manufacturers of metrology systems utilize one single technology to measure a wide range of components despite the different form factor of each of the components, which can drastically affect the quality of the measurement.